The global Molded Interconnect Substrate (MIS) market was valued at US$ 98 million in 2024 and is anticipated to reach US$ 228 million by 2031, witnessing a CAGR of 12.2% during the forecast period 2025-2031.
The molded interconnect substrate (MIS) market is gaining strong momentum as industries adopt advanced circuit integration solutions to meet growing demands for lightweight, compact, and multifunctional electronic devices. MIS technology enables the integration of circuit patterns directly onto three-dimensional plastic substrates, reducing the need for traditional printed circuit boards (PCBs) and enhancing design flexibility. With applications in automotive, consumer electronics, medical devices, and telecommunications, the MIS market is poised for robust growth.
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What is a Molded Interconnect Substrate (MIS)?
A molded interconnect substrate is a three-dimensional circuit carrier created using injection molding and laser direct structuring (LDS) technology. Conductive traces are applied directly onto molded plastic components, allowing electronic circuits to be integrated into compact and complex geometries.
Key benefits include:
- Miniaturization of electronic assemblies
- Reduced weight and material usage
- High design flexibility for complex structures
- Improved electrical performance with shorter interconnections
- Cost efficiency through simplified assembly and fewer components
These advantages make MIS an attractive solution for next-generation electronics.
Market Drivers
Rising Demand for Miniaturization
Consumer electronics and automotive sectors are pushing for compact designs without compromising functionality. MIS enables miniaturization by combining mechanical and electronic functions in one component.
Growth of Automotive Electronics
With the rise of electric vehicles (EVs), advanced driver-assistance systems (ADAS), and infotainment systems, MIS is increasingly used in sensors, antennas, and control modules.
Expansion of 5G and IoT Devices
MIS provides high-frequency performance and design flexibility for antennas, sensors, and communication modules, making it vital for 5G and IoT applications.
Medical Device Innovation
The healthcare industry is adopting MIS for minimally invasive devices, hearing aids, and diagnostic equipment that require compact, reliable circuit integration.
Market Segmentation
The molded interconnect substrate market can be segmented by:
- Technology: Laser direct structuring (LDS), two-shot molding, film insert molding
- Application: Automotive, consumer electronics, medical devices, telecommunications, industrial automation
- Material: Thermoplastics such as LCP (liquid crystal polymer), PBT (polybutylene terephthalate), PA (polyamide), and PC (polycarbonate)
Laser direct structuring (LDS) dominates the market due to its precision and widespread adoption in antenna manufacturing.
Regional Insights
- Asia-Pacific leads the market, with China, Japan, South Korea, and Taiwan driving demand due to strong electronics manufacturing and automotive production.
- Europe shows steady growth, fueled by advanced automotive technologies in Germany and the adoption of MIS in medical devices.
- North America remains significant, with demand driven by IoT devices, 5G infrastructure, and aerospace applications.
- Latin America is emerging, with growing electronics and automotive industries in Brazil and Mexico.
- Middle East & Africa present opportunities, especially in telecommunications and industrial applications.
Competitive Landscape
The MIS market is competitive, with global players focusing on innovation and large-scale manufacturing. Key companies include:
- LPKF Laser & Electronics AG
- Molex LLC
- TE Connectivity
- Amphenol Corporation
- Harting Technology Group
- SelectConnect Technologies
- RTP Company
These companies are investing in LDS technology, high-performance polymers, and advanced manufacturing processes to meet growing demand in electronics and automotive sectors.
Challenges and Opportunities
Challenges:
- High equipment and tooling costs for MIS production
- Technical limitations in high-power applications
- Dependence on specialized thermoplastic materials
Opportunities:
- Rising adoption in wearable devices and medical implants
- Expansion of 5G antennas and IoT modules
- Development of sustainable, recyclable thermoplastic substrates
- Growth in aerospace and defense applications requiring lightweight, high-performance electronics
Future Outlook
The molded interconnect substrate market is expected to grow steadily as industries push for innovation in compact, multifunctional, and eco-friendly electronics. Future trends will include:
- Increased adoption of MIS in EV sensors and 5G communication systems
- Wider use in miniaturized healthcare devices and wearable electronics
- Growth of smart home and industrial IoT solutions
- Sustainable MIS production with recyclable thermoplastics and energy-efficient processes
As demand for miniaturized, high-performance electronics accelerates, molded interconnect substrates will play a pivotal role in shaping the future of advanced device design and manufacturing.
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