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Molded Interconnect Substrate (MIS) Market Opportunities in Consumer Electronics Applications Forecast 2025 - 2031 | #molded Interconnect Substrate (MIS) Market

Molded Interconnect Substrate (MIS) Market Opportunities in Consumer Electronics Applications Forecast 2025 - 2031
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Molded Interconnect Substrate (MIS) Market Opportunities in Consumer Electronics Applications Forecast 2025 - 2031

The global Molded Interconnect Substrate (MIS) market was valued at US$ 98 million in 2024 and is anticipated to reach US$ 228 million by 2031, witnessing a CAGR of 12.2% during the forecast period 2025-2031.
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